2H17SH-KS02 STEPPING MOTOR Stepping Motor

Description

The K&S Model 9388 LaserPro is a state-of-the-art solder ball attachment machine designed for efficient integration with fine-pitch IC devices. It delivers high first-pass yields and is suitable for low-cost, fast ball size changeovers with minimal tooling requirements. The system employs a cold process, where only individual pads are heated using localized laser light, ensuring precise control. It features an advanced Pattern Recognition System (PRS) for alignment accuracy, a Class I laser system with integrated safety interlocks for operator protection, and a fully automated material handling system (MHS) for efficient device carrier and magazine management. 

Feature

High First-Pass Yields: Ensures reliable solder ball attachment with minimal defects, improving production efficiency.

Efficient Space and Facility Utilization: Optimized design for compact installation in production lines.

Low-Cost, Fast Ball Size Changeovers: Quick adjustments for different ball sizes with no major tooling required, minimizing downtime.

Cold Process: Localized heating of individual pads, ensuring only targeted areas are affected, preserving the integrity of surrounding components.

Application

Integrated Circuit (IC) Packaging: Widely used in semiconductor packaging processes for attaching solder balls to IC devices, ensuring a reliable connection between the chip and PCB.

Ball Grid Array (BGA) Assembly: Perfect for assembling BGAs, where precise solder ball attachment is essential for ensuring electrical conductivity and mechanical stability in the final product.

Flip-Chip Technology: Supports flip-chip assembly, providing accurate ball placement on flip-chip devices for high-performance electronics.